FCI's LGA775 Processor Socket Enables PCI Express® Signaling

ETTERS, PA (March 14, 2006) - FCI has developed a lead-free, 775-position LGA775 Processor Socket to enable the use of microprocessors that support PCI Express signaling in desktop PCs. Utilizing FCI�s patented BGA (Ball Grid Array) technology for motherboard attachment and an LGA (Land Grid Array) interface to the microprocessor, the LGA775 Processor socket performs as a low inductance device (<4 nH) with <1pF capacitance pin-to-pin to optimize the processor�s high-speed electrical performance. A low normal force contact with wiping action produces consistent and reliable electrical performance.

A pre-installed pickup cover facilitates placement using conventional pick-and-place equipment while the use of BGA termination technology allows the socket assembly to self-center on the PCB pads as well as self-level in the z-axis direction. An integrated lever system actuates the socket when the chip has been seated properly. BGA technology also reduces cost of assembly in contract manufacturing.

�Our LGA775 socket is RoHS-compliant and compatible with lead-free processing temperatures,� says Scott Kleinle, FCI Global Data Market Manager. �The socket has successfully met all qualifications required for use with industry leading processor chips.�

FCI also produces associated products such as SATA, ExpressCard, PCI Express Card Edge, DDRII memory sockets, and other standards-based connectors that are used in conjunction with the LGA775 Processor Socket.

# # #