Low-Profile Memory Socket from FCI for Very-Low-Profile DDR2 DIMM

ETTERS, PA (June 19, 2006) � FCI has developed low-profile vertical memory sockets that accept Very Low-Profile (VLP) DDR2 (Double Data Rate) memory module assemblies. The nominal 18.3mm high VLP memory module installed in a 10052286-series socket achieves a combined vertical height of less than 21.5mm. With this low height, vertical DIMM may now be viable in applications such as blade servers, sub-1U routers, telecom racks and embedded systems, where angled DIMM or horizontal SO-DIMM have typically dominated in the past.

�Replacing angled sockets with vertical sockets can reduce the required board space for add-in memory by up to 75 percent,� said David Sideck, FCI Regional Market Manager. �The vertical socket and DIMM orientation can also benefit air flow and aid thermal management within the system.�

The connectors provide mechanical voltage keying and end latches that minimize the overall socket profile. FCI�s low insertion force socket design provides for easy installation of memory modules. The force required to install a memory module is typically less than 22 pounds.

The 240-position, low-profile DDR2 vertical connectors are offered with through-mount leads for solder termination. Available solder tail options support use on 1.58mm (.062�) to 2.36mm (.093�) thick motherboards. Lead-free and RoHS-compatible options are available for both connector termination types to aid compliance with lead elimination initiatives.

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