Low-Profile Memory Socket from FCI for Very-Low-Profile DDR2 DIMM

ETTERS, PA (June 19, 2006) — FCI has developed low-profile vertical memory sockets that accept Very Low-Profile (VLP) DDR2 (Double Data Rate) memory module assemblies. The nominal 18.3mm high VLP memory module installed in a 10052286-series socket achieves a combined vertical height of less than 21.5mm. With this low height, vertical DIMM may now be viable in applications such as blade servers, sub-1U routers, telecom racks and embedded systems, where angled DIMM or horizontal SO-DIMM have typically dominated in the past.

“Replacing angled sockets with vertical sockets can reduce the required board space for add-in memory by up to 75 percent,” said David Sideck, FCI Regional Market Manager. “The vertical socket and DIMM orientation can also benefit air flow and aid thermal management within the system.”

The connectors provide mechanical voltage keying and end latches that minimize the overall socket profile. FCI‘s low insertion force socket design provides for easy installation of memory modules. The force required to install a memory module is typically less than 22 pounds.

The 240-position, low-profile DDR2 vertical connectors are offered with through-mount leads for solder termination. Available solder tail options support use on 1.58mm (.062”) to 2.36mm (.093”) thick motherboards. Lead-free and RoHS-compatible options are available for both connector termination types to aid compliance with lead elimination initiatives.

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