Molex Spring Clips for Mobile Devices

High durability spring clips offer smartphone makers maximum cost savings with superb interconnect performance over a wide working range.

Smartphone makers face challenges of PCB space, cost and assembly time when specifying the connections and shielding and grounding of electronic components in their mobile applications. These barriers can sometimes be circumvented with the use of simpler solutions such as spring clips (known also as spring contacts, grounding springs, spring fingers or RF contacts) to provide connections between electronic sub-components, modules or RF devices (example: antennas) and the phone�s PC board or casing. Molex spring clips lower component and assembly-processing costs with added benefits of wide working range and superb durability.

Features

• Wide working range from 0.25 to 1.10mm
• Anti-snag design
• Narrow clip width of 1.00mm
• 1,500 durability cycles
• Kinked ribs
• Device-to-PCB grounding contact
• RF-TO-PCN contact

Benefits

• Offers greater design flexibility with specific loading control
• Prevents contact damage during assembly processing and yield loss
• Supports small PCB applications
• Delivers sustained high performance
• Prevent solder wicking
• Reduces EMI noise and electrostatic discharge
• Provides great cost savings when with non-soldered wire-less devices

Markets and applications

• Smartphone and Mobile Devices
• Consumer / Data / Telecom /
• Networking
  • Digital cameras
  • Digital video recorders
  • Wireless LAN devices
  • Set top boxes
  • Small Office/Home Office (SOHO) switches and routers Industrial
  • Surveillance, security cameras and systems
  • Point-Of-Sale (POS) scanners

See also:
Spring Clips for Mobile Devices (.pdf) for more product information, specifications, applications and ordering information.