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Molex ZQSFP+ Interconnect System
 Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand* Enhanced Data Rate (EDR) applications, Molex�s zQSFP+ Interconnect System transmits up to 28 Gbps per-serial-lane data rates with excellent signal integrity (SI) and electromagnetic interference (EMI) protection enhanced by TempFlex® Cable Assemblies.
Features
- Preferential coupling design uses a narrow-edge coupled, blanked- and formed-contact geometry and insert molding
- Proven 28 Gbps data rate with potential up to 40 Gbps per lane
- Stacked integrated connectors include an elastomeric EMI gasket (Series 171565) or a metal EMI gasket (Series 171722)
- Identical mating interface as the QSFP+ connector for backward compatibility
- Surface Mount Technology (SMT) design (series 170432 version only)
- 0.80mm pitch host connector designed for placement beneath EMI cage
- Stacked integrated connectors and cages are available in three sizes (2-by-1, 2-by-2 and 2-by-3)
- Drop-in replacement product from TE Connectivity
Benefits
- Provides superior signal integrity (SI) performance, including extremely low insertion loss (IL) of <0.8dB at frequencies up through 14 GHz
- Meets or exceeds current requirements for 100 Gigabit Ethernet and InfiniBand* 100 Gigabit (EDR) applications. Supports current 10 Gbps Ethernet, 14 Gbps (FDR) InfiniBand and 16 Gbps Fiber Channel applications
- Provides superior EMI containment and suppression
- Protects end user�s current QSFP+ infrastructure investment
- Provides the option for placement on both sides of the PCB
- Supports pluggable applications
- Offers design options for high-density applications
- Provides a second-source option
Applications
- Telecommunication Equipment
- Hubs
- Servers
- Routers
- Switches
- Central Office
- Cellular Infrastructure
- Multi-Platform Service Systems
- Data Networking Equipment
See also:
Molex ZQSFP+ Interconnect System (EN) (.pdf) for more product information, specifications, applications and ordering information.
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