Molex zSFP+ Interconnect System

Molex launches the first complete zSFP+™ Interconnect System for 25 Gbps serial channels, delivering unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fiber Channel applications.

Features

• Patent-pending preferential coupling design uses a narrow-edge, coupled, blanked- and formed-contact geometry and insert molding
• Capable of handling 25 Gbps data rates
• Backward compatible with SFP+ form factor connectors
• Utilizes industry-standard footprint
• High-temperature thermoplastic housing
• Second sourced by TE Connectivity

Benefits

• Provides superior signal integrity (SI), mechanical and electrical performance
• Supports current 10 Gbps Ethernet and 16 Gbps Fiber Channel applications with additional margin without changing the host board design (for the SMT version)
• Same PCB footprint, mating interface and EMI cage dimensions
• Can be used as a drop-in replacement for current SFP+ designs
• Withstands lead-free processing
• Provides a fully tested, intermateable solution with performance compatibility

Applications

• Telecommunication and Data communication Equipment Switches, routers, hubs, Central office, cellular infrastructure and multi-platform service systems (DSL, Cable Data) Storage

See also:
Molex zSFP+ Interconnect System (EN) (.pdf) for more product information, specifications, applications and ordering information.