Molex Supports OCP's Open Standards

The rapid evolution of Artificial Intelligence (AI) is producing an explosion of new types of hardware accelerators for Machine Learning (ML) and Deep Learning (DL). Common requirements such as flexibility, robustness, serviceability, configuration management as well as power and cooling to make an open mezzanine module a smart design choice. Additional benefits include OAM as an open accelerator module supporting multiple suppliers, or a multiOAM, Universal Base Board (UBB) supporting various interconnect topologies.

In support of the OAM infrastructure, the Molex Mirror Mezz 15x11 solution was specifically developed as the sole connector interface between the module and the base board. Molex Mirror Mezz connectors offer superior signal integrity and density allowing customers to achieve mechanical and electrical targets required by next generation high speed systems. In addition to all necessary signaling, this 15x11 Mirror Mezz connector for OAM also transfers the necessary power to the modules creating an all-in-one solution for mezzanine connectivity.

Features

• 68mm x 22mm after mating
• 172 differential pairs (161 non-orphan fully shielded)
• 56Gbps or 112Gbps PAM4
• 1A/pin @1.5oz Copper after derating
• 90ohm+/-5%
• Supports either 12V or 48V input
• Up to 200W (12V) or 500W (48V)

See also:
Molex Supports OCP's Open Standards (pdf) for more product information, specifications and ordering information
OCP Accelerator Module Design Specification V1P0-3