FOR IMMEDIATE RELEASE

Molex Introduces AMC.0 B+ Connectors to meet Advanced TCA Specifications for High-Speed Interconnects

LISLE, Ill. � January 3, 2008 � As the market for high-speed interconnect technologies continues to grow, Molex Incorporated introduces its new 170-circuit AdvancedMC connector solution for 12.5 Gbps NRZ signal transmission. Molex AMC.0 B+ connectors support PIGMG AdvancedTCA industry specifications for next-generation mezzanine cards and are well-suited for a wide range of applications in the telecommunications, computing and IEEE 1386 markets, as well as non-ATCA application

�As an industry leader in the standards arena, Molex is uniquely positioned to influence product technology improvements that support next generation demands,� said David Stevenson, product manager, Molex Incorporated. �AMC.0 B+ connectors incorporate AdvancedTCA standard specifications for improved reliability, manageability and serviceability, resulting in an innovative product that allows hot-plugging of high-speed serial interconnects for advanced carrier grade equipment.�

Molex AMC.0 B+ connectors feature controlled impedance and reduced crosstalk, plus a footprint launch optimized for high-speed data rates. This enhanced footprint further reduces crosstalk by managing inter-pair affinity and incorporating additional ground vias for isolation. As a result, the connectors achieve a crosstalk of less than 3 percent at 12.5 Gbps and deliver superior signal integrity compared to competitive brands.

The new connectors are made with an insert-molded wafer press-fit design that uses very simple tooling and permits easy connector-to-PCB mounting. Unlike compression-style designs, which require Gold pads and hardware, the press-fit design does not require any additional hardware for application. Featuring tin or tin-lead tail plating options, Molex AMC.0 B+ connectors support RoHS requirements and are available in three versions: standard, pegless and extended height.

# # #