FOR IMMEDIATE RELEASE

Molex Introduces AMC.0 B+ Connectors to meet Advanced TCA Specifications for High-Speed Interconnects

LISLE, Ill. – January 3, 2008 – As the market for high-speed interconnect technologies continues to grow, Molex Incorporated introduces its new 170-circuit AdvancedMC connector solution for 12.5 Gbps NRZ signal transmission. Molex AMC.0 B+ connectors support PIGMG AdvancedTCA industry specifications for next-generation mezzanine cards and are well-suited for a wide range of applications in the telecommunications, computing and IEEE 1386 markets, as well as non-ATCA application

“As an industry leader in the standards arena, Molex is uniquely positioned to influence product technology improvements that support next generation demands,” said David Stevenson, product manager, Molex Incorporated. “AMC.0 B+ connectors incorporate AdvancedTCA standard specifications for improved reliability, manageability and serviceability, resulting in an innovative product that allows hot-plugging of high-speed serial interconnects for advanced carrier grade equipment.”

Molex AMC.0 B+ connectors feature controlled impedance and reduced crosstalk, plus a footprint launch optimized for high-speed data rates. This enhanced footprint further reduces crosstalk by managing inter-pair affinity and incorporating additional ground vias for isolation. As a result, the connectors achieve a crosstalk of less than 3 percent at 12.5 Gbps and deliver superior signal integrity compared to competitive brands.

The new connectors are made with an insert-molded wafer press-fit design that uses very simple tooling and permits easy connector-to-PCB mounting. Unlike compression-style designs, which require Gold pads and hardware, the press-fit design does not require any additional hardware for application. Featuring tin or tin-lead tail plating options, Molex AMC.0 B+ connectors support RoHS requirements and are available in three versions: standard, pegless and extended height.

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