TE Connectivity has added a new industry-standard 0603 device to its popular line of surface-mount PolySwitch™ devices. The femtoSMDC016F device consumes less than half the board space of prior-generation devices and helps protect sensitive electronics from damage caused by overcurrent and overtemperature events. The device’s fast time-to-trip and resettable functionality can help manufacturers reduce warranty costs and improve reliability of portable electronics such as:

The new PolySwitch™ femtoSMDC016F device provides a smaller footprint than other surface-mount devices – measuring a mere 1.6mm x 0.8mm x 0.5mm. This offers designers flexibility in space-constrained applications. Rated at 9V, the device provides a hold current of 0.16A, a maximum fault current rating of 40A and a maximum resistance of 4.2 ohms. The femtoSMDC device’s low power dissipation and fast time-to-trip (0.10 second at +25˚C and 1A) make it a logical solution for high-density board designs.

The femtoSMDC016F device is terminated with nickel-tin finish for superior solderability and is compatible with high-volume assembly processes. The EIA-compliant device is halogen-free, RoHS compliant and UL and CSA certified. Production quantities are now available in tape and reel packages.

See also:
PolySwitch femtoSMDC Device (.pdf) fore more product information, specifications, applications and ordering information.