TE Connectivity introduced ELCON Micro Wire-to-Board Power Solutions

TE Connectivity (TE) introduced ELCON Micro wire-to-board power solutions, which provide a high current up to 12.5A per pin in the standard industry footprint of 3.0mm. A standard footprint allows for easy upgrades to existing designs and makes our headers and cable plugs footprint-compatible with other suppliers. Custom cable assemblies round out our high current portfolio and provide design flexibility.

Benefits:

• Provide high current at 12.5A per pin in the common industry footprint of 3.0mm (contact pitch)
• Support different currents with multiple combinations of different wire sizes and 2 to 24 pin configurations
• A common industry footprint allows for easy upgrades to existing designs
• PCB footprint compatible with other suppliers
• Virtually fool-proof mating makes assembly easy for the customer
• Perform reliably in harsh environments with maximum operating temperature of 105°C and halogen-free material
• New cable plugs and custom cable assemblies provide added design flexibility

Applications:

• Server
• Switches/Routers
• Power supplies and distribution
• Gaming machines
• Printers
• Security systems
• Dryers
• Refrigerators
• Test equipment
• Measurement equipment
• Diagnostic equipment
• Patient monitors

See also:
TE Connectivity introduced ELCON Micro Wire-to-Board Power Solutions (.pdf) for more product information, specifications and ordering information.