TE Introduces MULTI-BEAM High Density (HD) Connectors

TE Connectivity's MULTI-BEAM High Density (HD) connectors offer higher current in less PCB space with up to 135A per power contact, featuring high density power and signal which saves space and reduces overall power consumption. The scalable and modular design also supports greater flexibility in configuration and PCB design.

Features:

• Enable high current density with power contacts that carry up to 135A each
• Facilitate modularity with flexible contact quantities, positions and types

Benefits:

• Enable high current density with power contacts that carry up to 135A each
• Facilitate modularity with flexible contact quantity and number of positions, and high and low power contact types
• Support up to 15 signals with integrated signal contacts in each end module
• Decrease new tooling investment with a tooling platform common for all configurations
• Reduce the total cost of current capacity with higher available current per contact
• Help improve reliability with low resistance and voltage drop

Applications:

• Servers
• Switches
• Routers
• Telecommunications Equipment
• Factory Automation
• Power Systems

See Also:
TE MULTI-BEAM High Density connectors (. pdf) for more product information, specifications, applications and ordering information.