TE Connectivity Introduces the Smaller Pitch and Higher Pin Count

TE Connectivity introduces the fourth generation, double data rate; dual inline memory module (DDR4 DIMM) product line enables reliable interconnection to memory modules for servers, storage, communications equipment, and desktop PCs.

The DDR4 DIMM product line provides a smaller pitch and higher pin count than the DDR3 DIMM product line. This product portfolio is designed to accept the JEDEC industry standard module and may be suitable for applications on new high-speed data platforms. Compared to the DDR3 DIMM product line, the DDR4 DIMM product line offers additional benefits, including a 20 percent (maximum) space savings on a printed circuit board (PCB), a connector height reduction of 10 percent (maximum), improved power consumption, and higher data rate support.

Features:

• Various mounting types: through hole, surface mount, and press fit
• Narrow and standard extractor options
• Various color options for connector housing and extractor
• Accepts memory module per JEDEC MO-309

Benefits:

• Enable a waterproof solution with up to an IPX8 rated connector
• Realize easy factory or field installation using independent push button termination for left and right side of the connector
• Save installation time and eliminate the need to pre-strip wires with insulation displacement technology(IDC)
• Manage inventory with three part numbers to accommodate eight different wire combinations

Applications:

• Servers
• Storage
• Communications equipment
• Desktop PCs

See Also:
TE Connectivity (TE) Introduces the Smaller Pitch and Higher Pin Count (. pdf) for more product information, specifications, applications and ordering information.