TE Connectivity Z-PACK Slim UHD Connectors

TE Connectivity introduces Z-PACK Slim UHD backplane connectors, a flexible and upgradeable system designed to fit 15 mm (0.6 inch) slot pitch applications and above. Z-PACK Slim UHD connectors have an extremely high contact density combined with excellent high speed signal performance, making them one of the densest backplane connectors on the market today.

Target Markets

• Data communications
• Industrial

Applications

• Telecommunications equipment
• Switches
• Routers
• Servers
• Factory automation

Key Benefits

• Support upgrades from 12.5 Gbps scalable up to 20 Gbps
• Design for high density applications with 55 signal lines/cm² (8 contacts per column - 12 columns per module)
• Feature a low profile, 7.85 mm height
• Help ensure proper alignment with integrated alignment correction
• Save space with modular end to end stack ability
• Allow for ease of assembly with press-fit termination technology and a micro-floatable contact design
• Complement this high speed connector with a 5 position power connector option